Material: FR4 KB6167 Layer: 8L, TG170 Blind vias: 2-4-2 Surface: ENIG 2u" Board Thickness: 1.60 mm, Copper Finished: 1/1/1/1/1/1/1/1Oz Black Solder mask, White Silkscreen Application: Used in Industrial Control device
￥ 0.00
0.00
Material: FR4 KB6167 Layer: 8L, TG170 Blind vias: 2-4-2 Surface: ENIG 2u" Board Thickness: 1.60 mm, Copper Finished: 1/1/1/1/1/1/1/1Oz Black Solder mask, White Silkscreen Application: Used in Industrial Control device
