PCBA Capabilities |
|
PCB Size |
Max. 610X1100mm |
Material |
CEM-1, CEM-3, FR4,
Rogers, Al base, FPC, Ceramic, Rigid-flex PCB |
Surface Finish |
HAL Lead-free HASL, Falsh
Gold, ENIG (Immersion Gold), OSP(Entek), Immersion Tin, Immersion Silver, Hard
Gold, ENEPIG |
Layer |
1 - 32L |
Thickness |
0.2 -6.0mm |
Components |
0201, 01005 |
Min. pin Space |
0.3mm |
Min. Ball Space |
0.3mm |
SMD Type |
BGA, WLCSP, QFN, POP,
Connectors, wires, cables |
SMD Machine Capability |
20,000,000 points/Day |
PCBA Electrical Testing |
AOI(100%), X-ray Inspection,
ICT (In-Circuit Test)/ Functional testing |
Soldering Type |
Lead free Wave Oven,
Lead free Reflow Oven, Hand soldering |
Other Process |
Three-proof coating, EMS
final assembly with enclosure, IC program, function testing, DFM analyse |
PCBA Package |
Static bag, Cotton card
slot, Carton board slot, Carton board slot with bubble, Custom plastic plate,
Custom logo print carton, etc |
SMT Line Equipment
Automatic loading machine |
PCB clean M/C |
G9+Automatic Paste Print M/C |
3D SPI paste inspection M/C |
Yamaha YSM24 SMT M/C |
Place PCB board inside the SMT machine Automatic board delivery to suction machine. |
Specially designed for cleaning tin beads and reflux trace and scratch. It does not generate static electricity, and never hurt the PCB board. |
Fully automatic, high-precision printing accuracy: ±0.025mm Repeat accuracy: ±0.01mm Maximum PCB board size: 610*600mm |
Detect missed printing, insufficient tin, excessive tin, continuous
tin, misalignment, poor shape, and surface contamination. Support rapid detection of soldering pads 03015, 01005, 0201. |
High speed module machine with high precision, capable of mounting
precision components such as 03015 and 01005. Position: 4*20=80 Speed: 4*3500 solder points/H Maximum PCB board size: 610*500mm |
Yamaha YSM20 SMT M/C |
Yamaha YSM10 SMT M/C |
Ten temperature zone wave oven |
Online AOI inspect M/C |
X-Ray |
Multi functional SMT machine, capable of mounting 01005 and 0.35mm BGA. Maximum mounting capacity: 686*508mm Position: 128. Speed: 25000 solder points/H |
Multi functional SMT machine, capable of mounting 01005 and 0.35mm BGA. Maximum PCB size: 774*710mm Standing position: 130 Speed: 35000 solder points/H |
Lead free, 10 temperature zone, smooth increase temperature, reliable
quality, capable of soldering ultra large and ultra thick PCBs. Temperature control accuracy: Within ±1 ℃, the maximum soldering size is 600mm wide. |
High speed mobile photo inspection, 8000mm²/s test PCB board size up to
650*500mm. |
Minimum focusing size 0.25um Suitable for open circuit and short
circuit detection of BGA, QFN and other components. |
PCB Capabilities |
|
Min. PCB Dimension |
Min. 5*5*0.3mm |
Max. PCB
Dimension |
1200*650mm |
PCB
Material |
CEM-1, CEM-3, FR4,
Rogers, Al base, FPC, Ceramic |
PCB
Surface Finish |
HAL Lead-free HASL, Falsh
Gold, ENIG (Immersion Gold), OSP(Entek), Immersion Tin, Immersion Silver, Hard
Gold, ENEPIG |
Chip
& IC size |
Min. 0201(0.5*0.25mm)
Max. 55mm |
Layer |
1 - 32L |
Copper Thickness |
Min. base copper: 1 / 4Oz |
Max. base copper: 6Oz |
|
Max. Aspect Ratio |
12 : 01mm |
Hole Size Tolerance |
±0.075(PTH)
±0.05mm(NPTH) |
Min. Hole Size |
0.1mm |
Min. BGA Size |
0.2mm |
PCB type |
Normal through hole, HDI
PCB, High Frequency, Buried and Blind vias PCB |
PCB Electrical Testing |
Flying probe testing,
E-testing jig, Automotic E-testing line |
PCB
Package |
Vaccum PCB in solid
carton box |
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