Material: FR4 IS400 Layer: 2L, TG150 Surface: Immersion Gold 2U" Board Thickness: 1.60 mm, Copper Finished: 4Oz Green Solder mask, White Silkscreen Application: Used in Communication Device
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Material: FR4 IS400 Layer: 2L, TG150 Surface: Immersion Gold 2U" Board Thickness: 1.60 mm, Copper Finished: 4Oz Green Solder mask, White Silkscreen Application: Used in Communication Device
