Material: FR4 NP155F Layer: 6L, TG150 Surface: ENIG 2u" Board Thickness: 2.40 mm, Copper Finished: 3/1/1/1/1/3Oz Dark Green Solder mask, White Silkscreen Application: Used in Communication Device
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Material: FR4 NP155F Layer: 6L, TG150 Surface: ENIG 2u" Board Thickness: 2.40 mm, Copper Finished: 3/1/1/1/1/3Oz Dark Green Solder mask, White Silkscreen Application: Used in Communication Device
