Material: FR4, NP175F Layer: 8L, TG170 Surface: Immersion Gold 2U" Board Thickness: 1.80 mm, Copper Finished: 2/1/1/1/1/1/1/2Oz Green Solder mask, White Silkscreen Application: Used in industrial control
￥ 0.00
0.00
Material: FR4, NP175F Layer: 8L, TG170 Surface: Immersion Gold 2U" Board Thickness: 1.80 mm, Copper Finished: 2/1/1/1/1/1/1/2Oz Green Solder mask, White Silkscreen Application: Used in industrial control
